Heat Sink Compound

 ASI CAC104 Heat Sink Compound is a non dripping, thermally conductive grease. ASI CAC104 greatly increases efficiency due to its high performance thermally conductive properties. It reduces thermal impedance of the air gap otherwise present between the mating surfaces of a semi-conductor and heat sink. ASI CAC104 has excellent thermal resistance of only 00.05C/W for a 0.001″ film, with an area of one square inch. It will not harden, dry out, or melt at temperatures up to 200ºC. ASI CAC104 is also used as a heat transfer material in highly efficient and detailed machinery and in the solar panel industry. ASI CAC104 greatly outperforms other heat sink compounds and can make a variety of applications more efficient.

Features of ASI CAC 104 Heat Sink Compound:

• High Performance, Non-curing Paste
• Ideal for a Wide Variety of Applications
• Thermally Conductive Grease
• Non Toxic, Non Melting
• Will Not Seperate or Bleed
• Excellent Dielectric Properties
• Excellent Resistance to Water and Oxidation

Additional Benefits:

• High Thermal Resistivity
• Easy to Dispense and Work With at a Variety of Extreme Temperatures
• Withstands a Wide Range of High Heat and Extreme Cold

ASI CAC 104 Heat Sink Compound can be used on a variety of applications.  Some applications include: solar panels, automotive application, corrosion protection, device lead potting, electronic encapsulating, disconnect junctions in electrical wiring systems, etc.